Please use this identifier to cite or link to this item: https://hdl.handle.net/11681/8567
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dc.contributorGeotechnical and Structures Laboratory (U.S.)-
dc.contributorInstallation Technology Transfer Program (U.S.)-
dc.contributor.authorBjella, Kevin L.-
dc.contributor.authorAstley, Beth N.-
dc.contributor.authorNorth, Ryan E.-
dc.date.accessioned2016-06-20T13:27:48Z-
dc.date.available2016-06-20T13:27:48Z-
dc.date.issued2010-09-
dc.identifier.urihttp://hdl.handle.net/11681/8567-
dc.descriptionTechnical Report-
dc.descriptionAbstract: Buried infrastructure at Military Construction (MILCON) project sites can cause large project cost overruns if not located and removed prior to the start of the project. This project demonstrated how geophysical survey tools can be utilized to locate buried materials. Utility piping and 55-gallon drums were buried in three soil types at various depths and standard off-the-shelf geophysical equipment was used to image the materials and quantify the benefits and pitfalls of each method. The techniques and examples from this demonstration can be used as a guide by personnel involved with MILCON project scoping when historic buried utilities or debris of unknown origin are present or suspected.-
dc.publisherCold Regions Research and Engineering Laboratory (U.S.)-
dc.publisherEngineer Research and Development Center (U.S.)-
dc.relationhttp://acwc.sdp.sirsi.net/client/en_US/search/asset/1002771-
dc.relation.ispartofseriesERDC TR ; 10-9.-
dc.rightsApproved for public release; distribution is unlimited.-
dc.sourceThis Digital Resource was created in Microsoft Word and Adobe Acrobat-
dc.subjectMILCON-
dc.subjectMilitary construction-
dc.subjectGeophysics-
dc.subjectGeophysical surveys-
dc.subjectGround penetrating radar-
dc.subjectElectromagnetic induction-
dc.subjectMetal detection-
dc.subjectElectrical conductivity profiling-
dc.subjectCapacitively-coupled resistivity-
dc.subjectBuried infrastructure-
dc.titleGeophysics for military construction projects-
dc.typeReporten_US
Appears in Collections:Technical Report

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